Hermetic Sealing for Optical Transceivers- Explaining the features of Parallel Seam Sealing
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- Hermetic Sealing for Optical Transceivers- Explaining the features of Parallel Seam Sealing
Hermetic sealing is an essential technology for protecting the delicate internal optical chips of optical transceivers from moisture, gases, and dust.
Parallel Seam Sealing is well-suited for applications requiring high reliability and durability, as it avoids issues—such as strength limitations, material degradation, and environmental regulatory concerns—associated with adhesive bonding or furnace sealing.
This article explains the characteristics of Hermetic Sealing and Parallel Seam Sealing for optical transceivers and compares them with other sealing methods.
What is Hermetic Sealing for optical transceivers
Hermetic sealing for optical transceivers is a packaging method that completely blocks moisture, gases, and dust from reaching the delicate internal optical chips.
Unlike the inexpensive non-hermetic designs using plastic or epoxy resin found in standard data centers, this method ensures maximum durability even in harsh environments.
The Necessity of Hermetic Sealing for Optical Transceivers
Optical transceivers installed in environments such as telecommunications carrier core networks (long-haul), outdoor settings, aerospace, and military applications require hermetic sealing.
Furthermore, hermetic sealing for optical transceivers in AI data centers has become an essential technology for ensuring the stable operation of ultra-high-speed, high-capacity communications, such as 800G and 1.6T.
Components such as EMLs (Electro-absorption Modulated Lasers) used in 800G/1.6T applications are sensitive to heat and humidity; even the ingress of minute amounts of moisture can lead to performance degradation or failure.
Since the failure of a single transceiver can cause an interruption to the entire large-scale computation, extremely high reliability is required.
Advantages of Parallel Seam Sealing for Optical Transceivers
Sealing methods for optical transceivers include Adhesive Sealing, Furnace Sealing and Parallel Seam Sealing.
Adhesive Sealing is unsuitable for optical transceivers because the adhesive itself allows moisture to permeate and the method does not support vacuum sealing.
AuSn and glass are commonly used as sealing materials for Furnace Sealing.
While both offer satisfactory hermeticity, AuSn presents issues regarding adoption; phenomena such as segregation—which leads to compositional non-uniformity and uneven distribution—can result in reduced strength.
Regarding the glass, it is susceptible to impact and contains lead, so it is expected to be subject to RoHS regulations.
Parallel Seam Sealing avoids the issues associated with adhesives or furnace sealing.
Hermetic sealing via Parallel Seam Welding eliminates contact with moisture and oxygen, theoretically preventing any degradation of characteristics.
Furthermore, sealing can be performed in various environments—such as nitrogen, dry air, or vacuum—the performance characteristics of the optical transceiver can be fully preserved.
| method | material | Performance | ||||
|---|---|---|---|---|---|---|
| Thermal effect on devices | Reliability | Hermeticity | Environmental effect | Ultimate vac. | ||
| Seam | Ni | 〇 Spot heating | ◎ Good strength /corrosion resistance | ◎ 10E-10 Pa･m3/s | ◎ No Influence | 10-5Pa |
| Furnace | AuSn | × Whole high temperature | △ Low strength from AuSn segregation | ◎ 10E-10 Pa･m3/s | ◎ No Influence | 10-5Pa |
| Glass | ×× Whole high temperature | 〇 Crack from the impact | ◎ 10E-10 Pa･m3/s | × Contains lead RoHS | 10-3Pa | |
| Glue | Resin | ◎ Room temperature | △ Degradation due to UV rays and solvents | × 10E-9 Pa･m3/s | 〇 May contain halogen | Impossible |
Parallel Seam Sealing is used for the hermetic sealing of optical transceivers.
Hermetic sealing for optical transceivers is a packaging method that completely blocks moisture, gases, and dust from reaching the delicate optical chips inside.
Hermetic sealing is an essential technology not only for optical transceivers installed in harsh environments—such as telecommunications carrier backbone networks, outdoor settings, aerospace, and military applications—but also for ensuring the stable operation of ultra-high-speed, high-capacity communications in AI data centers.
Parallel Seam Sealing offers excellent airtightness and enables sealing in diverse environments—such as nitrogen, dry air, or vacuum—making it a method that maximizes the performance characteristics of optical transceivers.
What are Nippon Avionics' Parallel Seam Welding Machine suitable for selling optical transceivers?
Nippon Avionics' NAW-6000 series Parallel Seam Sealer with Automatic Lid Placement are compatible with lidded packages featuring windows—such as those for mirror and imaging devices—and offer world-class lid placement accuracy.
A single unit handles package selling for sizes ranging from 2mm to 150mm.
Bonding both sides at a speed of 10 mm/sec. enhances productivity, while a split-sealing process for large packages-which tend to accumulate significant heat-minimizes stress and prevents cracking.
Detailed product specifications
Our product lineup also includes an automatic lid-loading unit designed to improve the yield of existing Parallel Seam Welding machines.
Leave your Parallel Seam Welding machine needed to Nippon Avionics!
Hermetic Sealing for Optical Transceivers- Explaining the features of Parallel Seam Sealing
| Joining Method | Parallel Seam Sealing |
|---|---|
| Processing Method | hermetically sealing |
| End Products | Optical transceiver |
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.