Hermetic sealing of optical device and hybrid IC
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- Parallel Seam Sealing
- Applications of Parallel Seam Sealing
- Hermetic sealing of optical device and hybrid IC
Parallel seam welding of optical device and hybrid IC
Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.
Applicable to various package types
- Pin grid array（Large sized ceramic PKG）
- Hybrid IC（Large sized metal PKG）
- Optical device（PKG with glass window）
- Device for optical communication（Metal PKG）
- Custom LSI（Round shaped seam PKG）
Features of the joining method
- It can be applied to hermetic sealing of packages with various shapes and sizes.
- Vacuum sealing, in addition to N2 sealing, can be made.
- As the parallel seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.
Related video
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Hermetic sealing of optical device and hybrid IC
| Joining Method | Parallel Seam Sealing |
|---|---|
| Processing Method | Parallel Seam Sealing |
| End Products | Optical Device and Hybrid IC |
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
Related Link
Products
- Parallel Seam Sealer：In N2 gas Type/semi- Automatic Type
- Parallel Seam Sealer：In Vacuum Type/semi- Automatic Type