ACF (Glass + FPC) Thermal Compression Bonding
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- Pulse Heat (Hot Bar Reflow) Soldering
- Applications of Pulse Heat (Hot Bar Reflow) Soldering
- ACF (Glass + FPC) Thermal Compression Bonding
ACF (Glass + FPC) Thermal Compression Bonding
Because pulse heat method can prevent lowering of temperature due to radiation by its temperature feedback function, it can thermoset the ACF more efficiently comparing to the constant heating type. Pulse heat method, where temperature can be controlled, is effective in the pre- bonding process in particular.
Furthermore, because the thermosetting process comes after the force application process, misalignment of ACF or non-connection of conductive particles can be prevented.
ACF (Glass + FPC) Thermal Compression Bonding
| Joining Method | Pulse Heat (Hot Bar Reflow) Soldering |
|---|---|
| Processing Method | Thermo-compression Joining |
| End Products | FPD |
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.